Qualcomm, Partners Testing HSPA+ and 3G/LTE Chips

Posted by John Overridex on Nov 12th, 2009 and filed under News RSS. You can follow any responses to this entry through the RSS 2.0. You can skip to the end and leave a response. Pinging is currently not allowed.

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Qualcomm announced that customers including LG, Nokia Siemens, Huawei and Sierra Wireless are testing its new chipsets. Expected to be in devices next year, they support dual-carrier HSPA+ and LTE, which interest T-Mobile and Verizon, respectively.
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Qualcomm is now providing customers with trial versions of
its newly developed multi-mode, high-speed wireless chips.
The Mobile Data Modem, or MDM8220, is the first to support
dual-carrier, high-speed packet access plus (DC-HSPA+), while the MDM9200 and
MDM9600, according to Qualcomm, are the…

Qualcomm, Partners Testing HSPA+ and 3G/LTE Chips

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